CIRCUIT BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a circuit board manufacturing method which can form a through hole at a predetermined position in a rolled condition without using a mold tool, and which can improve productivity.SOLUTION: A circuit board manufacturing method comprises: selectively forming an adhesive layer 20 on a surface on one side of a conductive layer 10 in such a manner that the adhesive layer 20 exists on a first region of the surface on the one side of the conductive layer 10 but not exists on a second region on a surface on the other side of the conductive layer 10; subsequently forming a support layer 30 for supporting the adhesive layer 20 on a surface of the adhesive layer 20 opposite to a surface of the adhesive layer 20 which contacts the conductive layer 10; selectively forming a resist layer 30 on a surface of the conductive layer 10 on the other side opposite to the surface on the one side in such a manner that a resist layer 40 does not exist in a region corresponding to the second region; and selectively removing the second region of the conductive layer 10 by using the resist layer 40 as a mask to form a through hole 12 through the conductive layer 10.