ASSEMBLY SUBSTRATE INSPECTION APPARATUS, INSPECTION METHOD, AND MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To detect with high accuracy a defect to be detected in an assembly substrate on the basis of an image captured by a camera, without any influence of displacement of lamination layers in the assembly substrate.SOLUTION: An inspection apparatus for an assembly substrate, which i...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI HISAO, YAMASHITA TARO, MIKI HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To detect with high accuracy a defect to be detected in an assembly substrate on the basis of an image captured by a camera, without any influence of displacement of lamination layers in the assembly substrate.SOLUTION: An inspection apparatus for an assembly substrate, which is formed of a plurality of unit substrates which laminate layers so that cavities are formed in each of the unit substrates includes: a camera for imaging each of the unit substrates corresponding to being products in the assembly substrate; and an image processing device for processing images of the unit substrates captured by the camera. The image processing device generates a reference image for an assembly substrate on the basis of the images of the unit substrates in the assembly substrate, for each assembly substrate, and compares the reference image for the assembly substrate with the images of the unit substrates in the assembly substrate, for each assembly substrate.