PACKAGE

PROBLEM TO BE SOLVED: To provide a package made of ceramic with a terminal for wiring.SOLUTION: The package comprises: a ceramic multilayer substrate 33 having a surface layer conductor pattern 21 for a high frequency signal, a surface layer conductor pattern 14 for a ground, a rear face conductor pattern 26 for a high frequency signal, a rear face conductor pattern 15 for a ground, an interlayer connection via 27 for a high frequency signal connected between the surface layer conductor pattern for the high frequency signal and the rear face conductor pattern for the high frequency signal, and an interlayer connection via 16 connected between the surface layer conductor pattern for the ground and the rear face conductor pattern for the ground; and a conductive base 2 that has a dielectric glass 10 inserted in a through hole forming an outer conductor, and a coaxial terminal inner conductor 8 for a high frequency signal, which is inserted in the dielectric glass, whose one end projects outward, and whose other end is connected to the rear face conductor pattern for the high frequency signal by a conductive connection member 29, and whose surface is jointed to the rear face conductor pattern for the ground on a rear face of the ceramic multilayer substrate by the conductive connection member.