RESIN COMPOSITION, POLYMER, CURED FILM, AND ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To provide: a resin composition capable of forming a cured film excellent in elongation property; a polymer suitable as a constituting component of the composition; a cured film formed from the composition; and electronic parts having the cured film.SOLUTION: A resin compositio...

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Bibliographische Detailangaben
Hauptverfasser: SHIMOYAMA YUJI, HANAMURA MASAAKI, YAMATO FUTOSHI, TAKEKAWA JUN, SAKO AKARI, HIRO AKIHITO, MIZUNO HIKARI, SAKURAI TOMOHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide: a resin composition capable of forming a cured film excellent in elongation property; a polymer suitable as a constituting component of the composition; a cured film formed from the composition; and electronic parts having the cured film.SOLUTION: A resin composition contains: (A) a polymer having a structural unit represented by formula (a1) and having a hydroxyl group, and a structural unit represented by formula (a2) and having a cationically polymerizable group; and (F) a solvent.