SUBSTRATE MODULE WITH RADIATOR PLATE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a substrate module with a radiator plate capable of suppressing overheating of a heating element, and a method of manufacturing the same.SOLUTION: A substrate module 10 with radiator plate includes: a radiator plate 20; a flexible wiring board 30 adhered to the radia...

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Bibliographische Detailangaben
Hauptverfasser:	AKAHA YOSHIHIRO, YAMAMOTO MASAMICHI, UENISHI NAOTA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate module with a radiator plate capable of suppressing overheating of a heating element, and a method of manufacturing the same.SOLUTION: A substrate module 10 with radiator plate includes: a radiator plate 20; a flexible wiring board 30 adhered to the radiator plate 20 through an adhesion layer 50 consisting of an adhesive agent or a sticker; and a light emitting element 40 mounted on the flexible wiring board 30. At least one connection part among connection parts 35-37 corresponding to respective terminals 41A-43A of the light emitting element 40 is positioned closer to the radiator plate 20 than a substrate part 34 due to deformation of the flexible wiring board 30.