SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which a scrub member can be cleaned without providing a cleaning unit for exclusive use, and to provide a substrate processing method.SOLUTION: A substrate processing apparatus 1 includes a spin chuck 2 having a holding pin 11 in contact with the peripheral end face of a substrate W, a rotary drive mechanism 13 for rotating the spin chuck 2 about the axis of rotation 8, a scrub member 15 which comes into contact with the main surface of the substrate W held by the spin chuck 2 and performs scrub cleaning thereof, a spray nozzle 25 for spraying a liquid to a cleaning object area set to match the peripheral region of the substrate W, and a scrub member drive mechanism 16 for moving the scrub member 15, in parallel with the cleaning of the peripheral region of a substrate by means of the spray nozzle 25, so as to perform scrub cleaning of the substrate W. The scrub member 15 moves along a travel path passing through the center of rotation of the substrate W and the cleaning object area, and is cleaned by means of the spray nozzle 25 in the cleaning object area.