PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which, by realizing thinning of a first metal film in a wiring portion and formation of a metal film with excellent covering around via holes, restrains reduction in electrical characteristic and reduction in reliabil...

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Bibliographische Detailangaben
1. Verfasser:	TANABE RYOMA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which, by realizing thinning of a first metal film in a wiring portion and formation of a metal film with excellent covering around via holes, restrains reduction in electrical characteristic and reduction in reliability due to ion residues and also can secure the reliability of electrical connection between wiring layers.SOLUTION: A first resist film 8 is formed so as to cover a first metal film 7 to be deposited in a via hole 4, and a first metal coat to be formed in an insulation layer other than the via hole is etched to make the first metal coat to be formed in an insulation layer other than the via hole thinner than the first metal film to be formed in the via hole, in which way a first thinned metal film 9 is formed.