DEFECT DETECTION APPARATUS

PROBLEM TO BE SOLVED: To suitably detect defects of wiring on a substrate.SOLUTION: An infrared camera 4 is attached to a beam section 12c of a gantry 12, the beam section being disposed across an alignment stage 11 having a mother board 1 placed thereon, such that the relative position with respect...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAKURA YUKIHIKO, KOKETSU HIDETO, UEDA YASUHIRO, SHINOZAKI TOSHIYUKI, MORITA HARUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING ELECTRIC VARIABLES MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suitably detect defects of wiring on a substrate.SOLUTION: An infrared camera 4 is attached to a beam section 12c of a gantry 12, the beam section being disposed across an alignment stage 11 having a mother board 1 placed thereon, such that the relative position with respect to the board surface of the mother board 1 placed on the alignment stage 11 is fixed in the direction perpendicular to the board surface.