ELECTROLESS PLATING METHOD AND WIRING BOARD

PROBLEM TO BE SOLVED: To provide an electroless plating method capable of forming high density copper wiring without using a resin pattern mask.SOLUTION: An electroless plating method of the embodiment includes: a UV irradiation step of irradiating a partial region of a resin substrate 10 of cyclool...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HONMA HIDEO, SHINJO SAYAKA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electroless plating method capable of forming high density copper wiring without using a resin pattern mask.SOLUTION: An electroless plating method of the embodiment includes: a UV irradiation step of irradiating a partial region of a resin substrate 10 of cycloolefin polymer with an ultraviolet light; a catalyst application step of applying a catalyst of an electroless plating reaction to a surface of the resin substrate; and a plating step of selectively forming a wiring pattern of a copper plating film in the ultraviolet light irradiation region by using an electroless copper plating bath. In the electroless copper plating bath, 2-mercapto benzotriazole is included as an inhibitor, and a pattern size of the copper plating film is less than a size of the ultraviolet light irradiation region.