THERMOSETTING RESIN COMPOSITION, RESIN FILM, COPPER-CLAD SHEET AND FLEXIBLE PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in warpage, dimensional stability and flexibility and is capable of manufacturing a flexible printed wiring board without using a substrate such as a polyimide film.SOLUTION: A thermosetting resin composition compri...

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Bibliographische Detailangaben
Hauptverfasser: TANAHASHI YUSUKE, ISHIZAKA MASANOBU, KAKIUCHI NAOYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in warpage, dimensional stability and flexibility and is capable of manufacturing a flexible printed wiring board without using a substrate such as a polyimide film.SOLUTION: A thermosetting resin composition comprises (A) an alicyclic epoxy resin, (B) an aromatic diamine compound and (C) at least one chosen from a solvent-soluble polyimide having a Tg of ≥250°C and a solvent-soluble polyamide imide having a Tg of ≥250°C. The total amount of (C) the solvent-soluble polyimide and the solvent-soluble polyamide imide is ≥30 pts.mass and ≤100 pts.mass based on 100 pts.mass of the total amount of (A) the alicyclic epoxy resin and (B) the aromatic diamine compound.