IMAGING MODULE

PROBLEM TO BE SOLVED: To provide an imaging module capable of obtaining an image of high image quality with less noise.SOLUTION: An imaging module comprises: an image chip that has a first portion including a photoelectric conversion unit having a plurality of pixels which are arranged in a two-dime...

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Bibliographische Detailangaben
1. Verfasser: MOROHASHI DAIKICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an imaging module capable of obtaining an image of high image quality with less noise.SOLUTION: An imaging module comprises: an image chip that has a first portion including a photoelectric conversion unit having a plurality of pixels which are arranged in a two-dimensional matrix form and photoelectrically convert received light, and a second portion including a column scanning circuit which scans one direction of the photoelectric conversion unit; a first heat conductive member that conducts heat of the first portion; and a second heat conductive member that conducts heat of the second portion. A space is provided between the first heat conductive member and the second heat conductive member.