THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition suitable for forming a flexible coated film showing excellence in adhesion to a base material, folding resistance, low warpage, solder heat resistance, electroless gold plating resistance, electric insulation and the like, and to pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YONEDA KAZUYOSHI, ARIMA MASAO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermosetting resin composition suitable for forming a flexible coated film showing excellence in adhesion to a base material, folding resistance, low warpage, solder heat resistance, electroless gold plating resistance, electric insulation and the like, and to provide a printed wiring board on which a protective film and an insulation layer each composed of the cured product are formed.SOLUTION: A thermosetting resin composition includes (A) an oligomer containing a group reacting with an epoxy group derived from an alicyclic or aliphatic isocyanate and (B) an epoxy resin as a thermosetting resin. The thermosetting resin composition preferably contains (C) a curing accelerator and an inorganic and/or organic filler.