EPOXY RESIN LIQUID SEALING MATERIAL FOR UNDERFILLING, AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin liquid sealing material for underfilling, which can be cured in a short time at low temperature, can be filled in even a narrow gap in a few minutes at room temperature, and is excellent in temperature cycling resistance.SOLUTION: An epoxy resin liquid...

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Bibliographische Detailangaben
Hauptverfasser:	MASUDA TOMOYA, TENDO KAZUYOSHI, KONDO HIROKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin liquid sealing material for underfilling, which can be cured in a short time at low temperature, can be filled in even a narrow gap in a few minutes at room temperature, and is excellent in temperature cycling resistance.SOLUTION: An epoxy resin liquid sealing material for underfilling comprises an epoxy resin (A), a compound (B) having a phosphoester group, and a latent curing agent (C). The compound (B) having the phosphoester group is used as a wetting dispersant. The epoxy resin liquid sealing material further comprises an inorganic filler (D). A reactant of the epoxy resin with an amine compound is used as the latent curing agent (C).