PRESSURE-SENSITIVE ADHESIVE TAPE FOR SEMICONDUCTOR WAFER SURFACE PROTECTION

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for semiconductor wafer surface protection that sufficiently follows unevenness of a semiconductor wafer surface when being pasted to the semiconductor wafer surface, that keeps the state, and that can decrease generation of dimples...

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Bibliographische Detailangaben
1. Verfasser:	OKURA MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for semiconductor wafer surface protection that sufficiently follows unevenness of a semiconductor wafer surface when being pasted to the semiconductor wafer surface, that keeps the state, and that can decrease generation of dimples of a semiconductor wafer grinding surface and breakage of the semiconductor wafer when a back of the semiconductor wafer is ground.SOLUTION: A pressure-sensitive adhesive tape for semiconductor wafer surface protection has an adhesive layer comprising a pressure-sensitive adhesive of a pressure sensitive type on a base film, and follows unevenness when being pasted to a wafer that has unevenness on a surface, wherein a shape fixation ratio to the unevenness is at least 50%.