CAPACITIVE MICRO-ELECTRO-MECHANICAL SENSOR WITH SINGLE CRYSTAL SILICON ELECTRODE

PROBLEM TO BE SOLVED: To provide capacitive sensors with single crystal silicon on all key stress points.SOLUTION: Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices, a pressure po...

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Bibliographische Detailangaben
Hauptverfasser:	RAY CURTIS A, BRYZEK JANUSZ
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GYROSCOPIC INSTRUMENTS IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY NAVIGATION PERFORMING OPERATIONS PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS RESONATORS SEMICONDUCTOR DEVICES SURVEYING TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide capacitive sensors with single crystal silicon on all key stress points.SOLUTION: Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices, a pressure port is opposed to the electrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in-plane acceleration and out-of-plane acceleration are also described. A third in-plane axis can easily be obtained by duplicating an accelerometer that is rotated 90 degrees around the out-of-plane axis. Creation of resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeticity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafer level packaging, small size, high performance and low cost.