SUPPORT BASE PLATE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE INSPECTION METHOD

SUPPORT BASE PLATE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a support base plate, a semiconductor device manufacturing method and a semiconductor device inspection method, which can consistently reinforce a wafer from thinning of the wafer to inspection of electric characteristics of the semiconductor device.SOLUTION: A suppo...

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1. Verfasser: EZAKI AKIRA
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator EZAKI AKIRA
description PROBLEM TO BE SOLVED: To provide a support base plate, a semiconductor device manufacturing method and a semiconductor device inspection method, which can consistently reinforce a wafer from thinning of the wafer to inspection of electric characteristics of the semiconductor device.SOLUTION: A support base plate according to an embodiment comprises: a first support substrate which has an outer diameter larger than a diameter of a semiconductor substrate and an inner diameter smaller than the diameter of the semiconductor substrate by 2-6 mm; and a second support substrate which has an outer diameter not exceeding the inner diameter of the first support substrate, and in which a plurality of through holes piercing from a surface to a rear face are formed, and which is made of the same material and has the same thickness with the first support substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUPPORT BASE PLATE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE INSPECTION METHOD
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