SUPPORT BASE PLATE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide a support base plate, a semiconductor device manufacturing method and a semiconductor device inspection method, which can consistently reinforce a wafer from thinning of the wafer to inspection of electric characteristics of the semiconductor device.SOLUTION: A support base plate according to an embodiment comprises: a first support substrate which has an outer diameter larger than a diameter of a semiconductor substrate and an inner diameter smaller than the diameter of the semiconductor substrate by 2-6 mm; and a second support substrate which has an outer diameter not exceeding the inner diameter of the first support substrate, and in which a plurality of through holes piercing from a surface to a rear face are formed, and which is made of the same material and has the same thickness with the first support substrate.