GRINDING DEVICE, AND GRINDING METHOD

PROBLEM TO BE SOLVED: To provide a grinding device and a grinding method which can reduce a workload of the inclination adjustment of a holding table without measuring the thickness of a workpiece at each other time of measurement.SOLUTION: A grinding device has a control means. The control means in...

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1. Verfasser: OKAZAKI MORIO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a grinding device and a grinding method which can reduce a workload of the inclination adjustment of a holding table without measuring the thickness of a workpiece at each other time of measurement.SOLUTION: A grinding device has a control means. The control means includes: a reference data storing part for storing measurement data measured by a height position measuring means as reference data; a comparing part for comparing measurement data measured at the height position of a holding surface by the height position measuring means in predetermined timing, with the reference data stored in the reference data storing part; and an inclination changing means controller which, when a difference is found between the reference data and the measurement data compared by the comparing means, changes the inclination of the holding table by making an inclination changing means act, and makes the height position of the holding surface follow the height position in the reference data.