MANUFACTURING METHOD OF VIBRATION PIECE, VIBRATION PIECE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a manufacturing method of a vibration piece that has a high yield and has few variations in thickness accuracy when being diced from a substrate.SOLUTION: A manufacturing method of a vibration piece comprises: a deposition step of providing a piezoelectric layer 54 a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: II TOSHIHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a vibration piece that has a high yield and has few variations in thickness accuracy when being diced from a substrate.SOLUTION: A manufacturing method of a vibration piece comprises: a deposition step of providing a piezoelectric layer 54 and electrode layers (a lower electrode layer 52 and an upper electrode layer 56) electrically connected to the piezoelectric layer 54 on one principal surface of a substrate 50; a substrate protection step of providing a protection member on the one principal surface subsequent to the deposition step; a plate thickness adjustment step of removing a part of the substrate 50 from the other principal surface side of the substrate 50 and adjusting a thickness of the substrate 50 subsequent to the substrate protection step; and an outer shape formation step of patterning along a desired outer shape of an element piece with respect to the substrate 50 subsequent to the plate thickness adjustment step.