CONNECTION METHOD USING ANISOTROPIC CONDUCTIVE MATERIAL AND ANISOTROPIC CONDUCTIVE ASSEMBLY

PROBLEM TO BE SOLVED: To provide a connection method which does not cause breakage and deformation of an electronic component and heating unevenness between a central part and an end of the electronic component, and which is also capable of suppressing insufficient crushing of a conductive particle...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HATTORI MASAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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