CONNECTION METHOD USING ANISOTROPIC CONDUCTIVE MATERIAL AND ANISOTROPIC CONDUCTIVE ASSEMBLY

PROBLEM TO BE SOLVED: To provide a connection method which does not cause breakage and deformation of an electronic component and heating unevenness between a central part and an end of the electronic component, and which is also capable of suppressing insufficient crushing of a conductive particle at the end and obtaining an anisotropic conductive assembly having an excellent resistance value even with the lapse of time.SOLUTION: A connection method includes the steps of: arranging an anisotropic conductive film 3 containing a conductive particle 4, a second electronic component 5, and a cushioning material 7 including a first region and a second region having a larger thermal conductivity than the first region in this order on a terminal 2 of a first electronic component 1; and heating and pressing the second electronic component 5 by a heating and pressing member 8 via the cushioning material 7 arranged in the arrangement step. The arrangement step arranges the first region in a central part of the second electronic component 5 in a longitudinal direction of the second electronic component 5 and the second region in both ends of the second electronic component 5 in the longitudinal direction of the second electronic component 5.