MOUNTING MEMBER OF LED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a mounting member of an LED substrate, which can easily mount an LED substrate on a mounting object and has superior heat dissipation.SOLUTION: As for a mounting member of an LED substrate, as a substrate installation face 61 of a platy member 1 is made to be opposed...

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Bibliographische Detailangaben
Hauptverfasser:	ENDO MUTSUO, UEKI MASATAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting member of an LED substrate, which can easily mount an LED substrate on a mounting object and has superior heat dissipation.SOLUTION: As for a mounting member of an LED substrate, as a substrate installation face 61 of a platy member 1 is made to be opposed to a frame edge face 56 of the LED substrate 51, power supply terminals 3, 5 are brought into abutment with electrode wirings 53, 55 of the LED substrate 51 to be electrically connected. Further, the frame edge face 56 of the LED substrate 56 is pressed by convex contact parts 36-39 of the power supply terminals 3, 5, and the backside of the LED substrate 56 is pressed to a backside contact face 2C of a rear member 2, a heat radiation to a mounting object through the rear member 2 from the backside of the LED substrate 56 can be improved.