MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a technique for cutting and removing surplus resin stably in a mold process.SOLUTION: In a process for separating a part of a runner connected to a resin sealing body 8 from the resin sealing body 8, the runner consists of a first runner 28, and a second runner 30 connected with the first runner 28 and the resin sealing body 8. The second runner 30 is supported by a first support 34 from the second surface of a lead frame 2 and, while floating the resin sealing body 8 in the air, the first runner 28 is pushed off the first surface of the lead frame 2 toward the second surface by means of a break pin 32, thus separating the runner from the way of the second runner 30.