SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD

PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTIO...

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1. Verfasser:	KONDO HIROTSUGU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	KONDO HIROTSUGU
description	PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTION: A substrate includes: a first land 6A including a through hole 6H by which a terminal 9 is fixed by soldering; and a second land 6B which is provided at a position extending from the first land 6A and may supply melting solder to the first land 6A. A soldering apparatus 10 includes: a laser light radiation device 1 which is formed so as to switch the radiation state between a first radiation state where only the second land 6B is irradiated with laser light and a second radiation state where the first land 6A is irradiated with laser light; and a solder supply device 2 which may supply solder to at least the second land 6B.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013187411A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013187411A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013187411A3</originalsourceid><addsrcrecordid>eNrjZDAJDnUKDglyDHHVUQj293FxDfL0c1dwDAhwBIqFBusoOPq5IEn4uoZ4-LvwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0NjQwtzE0NDR2OiFAEAGfsnzw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD</title><source>esp@cenet</source><creator>KONDO HIROTSUGU</creator><creatorcontrib>KONDO HIROTSUGU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTION: A substrate includes: a first land 6A including a through hole 6H by which a terminal 9 is fixed by soldering; and a second land 6B which is provided at a position extending from the first land 6A and may supply melting solder to the first land 6A. A soldering apparatus 10 includes: a laser light radiation device 1 which is formed so as to switch the radiation state between a first radiation state where only the second land 6B is irradiated with laser light and a second radiation state where the first land 6A is irradiated with laser light; and a solder supply device 2 which may supply solder to at least the second land 6B.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130919&DB=EPODOC&CC=JP&NR=2013187411A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130919&DB=EPODOC&CC=JP&NR=2013187411A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONDO HIROTSUGU</creatorcontrib><title>SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTION: A substrate includes: a first land 6A including a through hole 6H by which a terminal 9 is fixed by soldering; and a second land 6B which is provided at a position extending from the first land 6A and may supply melting solder to the first land 6A. A soldering apparatus 10 includes: a laser light radiation device 1 which is formed so as to switch the radiation state between a first radiation state where only the second land 6B is irradiated with laser light and a second radiation state where the first land 6A is irradiated with laser light; and a solder supply device 2 which may supply solder to at least the second land 6B.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJDnUKDglyDHHVUQj293FxDfL0c1dwDAhwBIqFBusoOPq5IEn4uoZ4-LvwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0NjQwtzE0NDR2OiFAEAGfsnzw</recordid><startdate>20130919</startdate><enddate>20130919</enddate><creator>KONDO HIROTSUGU</creator><scope>EVB</scope></search><sort><creationdate>20130919</creationdate><title>SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD</title><author>KONDO HIROTSUGU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013187411A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KONDO HIROTSUGU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KONDO HIROTSUGU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD</title><date>2013-09-19</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTION: A substrate includes: a first land 6A including a through hole 6H by which a terminal 9 is fixed by soldering; and a second land 6B which is provided at a position extending from the first land 6A and may supply melting solder to the first land 6A. A soldering apparatus 10 includes: a laser light radiation device 1 which is formed so as to switch the radiation state between a first radiation state where only the second land 6B is irradiated with laser light and a second radiation state where the first land 6A is irradiated with laser light; and a solder supply device 2 which may supply solder to at least the second land 6B.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T10%3A50%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KONDO%20HIROTSUGU&rft.date=2013-09-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013187411A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true