SUBSTRATE, SOLDERING APPARATUS, AND SOLDERING METHOD

PROBLEM TO BE SOLVED: To provide a soldering apparatus which solves a problem that burning is caused in an electronic component by laser light used as a heat source for melting solder while making an apparatus structure and processes simpler, and to provide a soldering method and a substrate.SOLUTION: A substrate includes: a first land 6A including a through hole 6H by which a terminal 9 is fixed by soldering; and a second land 6B which is provided at a position extending from the first land 6A and may supply melting solder to the first land 6A. A soldering apparatus 10 includes: a laser light radiation device 1 which is formed so as to switch the radiation state between a first radiation state where only the second land 6B is irradiated with laser light and a second radiation state where the first land 6A is irradiated with laser light; and a solder supply device 2 which may supply solder to at least the second land 6B.