COOLING SYSTEM OF ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To improve heat transfer performance of an evaporator built in a thermal connector of a second vaporization-type cooling device (thermal highway) in an allowable installation space in a cooling system of an electronic device, and to prevent dryness of a heat transfer surface du...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KONDO YOSHIHIRO, FUJII TATSURO, TOYODA HIROYUKI, TAKEDA FUMIO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve heat transfer performance of an evaporator built in a thermal connector of a second vaporization-type cooling device (thermal highway) in an allowable installation space in a cooling system of an electronic device, and to prevent dryness of a heat transfer surface due to lowering of a liquid level during an operation.SOLUTION: The evaporator of the second vaporization-type cooling device (thermal highway) is provided with a slit formed in a direction orthogonal to an evaporation side surface of a heat transfer plate vertically arranged. The evaporator is provided with a liquid supply guide parallel with a liquid level of a coolant at an intermediate position in the height direction of the heat transfer plate. An opening of a steam/liquid pipe is arranged above the liquid supply guide to form a flow passage of a steam generated by the evaporator and the coolant condensed by a condenser. A wire net is provided on a top surface of the liquid supply guide, and a steam passage is provided in the liquid supply guide. A side plate having a height capable of storing the coolant is provided in a restriction-free edge of the liquid supply guide.