PREPREG, SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING PREPREG, METHOD OF MANUFACTURING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a prepreg which prevents air bubbles from remaining when laminated and which has excellent mechanical strength, a substrate provided with the prepreg, a semiconductor device using the substrate, and methods of manufacturing them.SOLUTION: A prepreg 1 includes a fiber...

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Hauptverfasser:	HATANO HARUYUKI, ANADA KOHEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SEMICONDUCTOR DEVICES TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a prepreg which prevents air bubbles from remaining when laminated and which has excellent mechanical strength, a substrate provided with the prepreg, a semiconductor device using the substrate, and methods of manufacturing them.SOLUTION: A prepreg 1 includes a fiber base material 2 formed in a layered form, and a resin layer 32 formed on at least one surface side of the fiber base material 2 and structured of a resin composition. The prepreg 1 includes a void layer 21 in which the resin composition is not impregnated and which is formed in at least a part of the fiber base material 2.