WIRE SAW AND DUCT DEVICE FOR WIRE SAW

PROBLEM TO BE SOLVED: To provide a wire saw capable of preventing a working fluid from scattering to a periphery and also sufficiently supplying the working fluid to a cut portion to improve a cutting performance, and to provide a duct device for the wire saw.SOLUTION: A wire saw 20 includes: a work...

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Bibliographische Detailangaben
Hauptverfasser:	MINONISHI MIKIO, TANIZAKI HIROSHI, YABU YOSUKE, MORIMOTO SHIGEO, KAWAZU TOMOYUKI, CHO JINSAI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wire saw capable of preventing a working fluid from scattering to a periphery and also sufficiently supplying the working fluid to a cut portion to improve a cutting performance, and to provide a duct device for the wire saw.SOLUTION: A wire saw 20 includes: a working fluid supply device 29 for supplying a working fluid S; a cylinder 37 for relatively moving a workpiece W to wire 26 in running; and a duct member 40, which is connected to a working fluid supply device 29, closely arranged at the workpiece W, and has a second working fluid supply space S2 where the wire 26 passes, and also which generates a static pressure in the vicinity of the workpiece W in the second working fluid supply space S2 by supplying the working fluid from the upstream side in the running direction of the wire 26 toward a portion where the workpiece W is cut.