COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES
PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacr...
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creator | VLASTA BRUSIC JEFFREY DYSARD THOMPSON CHRISTOPHER |
description | PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacrylic acid; optionally, a calcium-containing compound; optionally, a biocide; optionally, a pH adjusting agent; and water. The method uses the composition to chemically-mechanically polish a substrate. |
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The method uses the composition to chemically-mechanically polish a substrate.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130909&DB=EPODOC&CC=JP&NR=2013179360A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130909&DB=EPODOC&CC=JP&NR=2013179360A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VLASTA BRUSIC</creatorcontrib><creatorcontrib>JEFFREY DYSARD</creatorcontrib><creatorcontrib>THOMPSON CHRISTOPHER</creatorcontrib><title>COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES</title><description>PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacrylic acid; optionally, a calcium-containing compound; optionally, a biocide; optionally, a pH adjusting agent; and water. The method uses the composition to chemically-mechanically polish a substrate.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w-EutgYsjiFN7UlzF5LLXIrESbRQ_x8XP8DpLW-t2LIPnFCQKUHHEQIPmHqkK5ghe6Tsj5ZDcBEMtSAohjB7QILWeJOsIwdJYraSo0tbtXpMz6Xsfm7UvnNi-0OZ32NZ5uleXuUz3sKpqnXdXPS5Mvqv9AXpRS-_</recordid><startdate>20130909</startdate><enddate>20130909</enddate><creator>VLASTA BRUSIC</creator><creator>JEFFREY DYSARD</creator><creator>THOMPSON CHRISTOPHER</creator><scope>EVB</scope></search><sort><creationdate>20130909</creationdate><title>COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES</title><author>VLASTA BRUSIC ; JEFFREY DYSARD ; THOMPSON CHRISTOPHER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013179360A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>VLASTA BRUSIC</creatorcontrib><creatorcontrib>JEFFREY DYSARD</creatorcontrib><creatorcontrib>THOMPSON CHRISTOPHER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VLASTA BRUSIC</au><au>JEFFREY DYSARD</au><au>THOMPSON CHRISTOPHER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES</title><date>2013-09-09</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacrylic acid; optionally, a calcium-containing compound; optionally, a biocide; optionally, a pH adjusting agent; and water. The method uses the composition to chemically-mechanically polish a substrate.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
title | COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES |
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