COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES

PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VLASTA BRUSIC, JEFFREY DYSARD, THOMPSON CHRISTOPHER
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide compositions and methods for planarizing or polishing a substrate.SOLUTION: The composition contains: an abrasive comprising alumina particles optionally treated with a polymer; an α-hydroxycarboxylic acid; an oxidizing agent that oxidizes at least one metal; polyacrylic acid; optionally, a calcium-containing compound; optionally, a biocide; optionally, a pH adjusting agent; and water. The method uses the composition to chemically-mechanically polish a substrate.