METHOD FOR MANUFACTURING SAPPHIRE SUBSTRATE AND SAPPHIRE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a sapphire substrate capable of shortening a manufacturing step and reducing a manufacturing cost by easily and quickly reducing unevenness of thickness of the sapphire substrate and a processing amount, and to provide the sapphire substrat...

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Bibliographische Detailangaben
1. Verfasser:	YOSHII MOTOYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a sapphire substrate capable of shortening a manufacturing step and reducing a manufacturing cost by easily and quickly reducing unevenness of thickness of the sapphire substrate and a processing amount, and to provide the sapphire substrate.SOLUTION: A method for manufacturing a sapphire substrate by applying processing covering a plurality of steps to a substrate obtained by slicing a sapphire ingot includes the steps of: grinding one or both sides of a substrate 10; processing the one or both sides of the ground substrate 10 by wet blasting after the grinding step; lapping the one or both sides of the substrate 10 processed by wet blasting after the wet blasting step; and polishing the one or both sides of the lapped substrate 10 by CMP after the lapping step.