ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMATION METHOD USING SAID COMPOSITION, AND ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMATION METHOD USING SAID COMPOSITION, AND ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide: an actinic ray-sensitive or radiation-sensitive resin composition improved in CDU and roundness and suited even for a liquid immersion process with a line width of 45 nm or less; an actinic ray-sensitive or radiation-sensitive film and a pattern formation method whi...

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Bibliographische Detailangaben
Hauptverfasser: SHIBUYA AKINORI, IWATO KAORU, TOKUGAWA YOKO, SUGIYAMA SHINICHI, MATSUDA TOMOKI, FUKUHARA TOSHIAKI, ITO JUNICHI, TANGO NAOHIRO, KATAOKA SHOHEI, YOSHITOME MASAHIRO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide: an actinic ray-sensitive or radiation-sensitive resin composition improved in CDU and roundness and suited even for a liquid immersion process with a line width of 45 nm or less; an actinic ray-sensitive or radiation-sensitive film and a pattern formation method which use the composition; and an electronic device manufacturing method and an electronic device.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (A) represented by the specified general formula (1), and a resin (B) whose solubility in an alkaline developer is increased by the action of an acid. (The meaning of each symbol in the general formula (1) is described in the claims.)