RESIN SEALING DEVICE AND METHOD FOR MANUFACTURING RESIN SEALING BODY

PROBLEM TO BE SOLVED: To provide a resin sealing device reducing dispersion in the thickness of a sealing resin when electronic parts are resin-sealed by compression molding by using a powdery or granular material for resin sealing.SOLUTION: A resin sealing device 1A includes a molding die with a ca...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKASE SHINJI, SUNADA MAMORU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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