RESIN SEALING DEVICE AND METHOD FOR MANUFACTURING RESIN SEALING BODY

PROBLEM TO BE SOLVED: To provide a resin sealing device reducing dispersion in the thickness of a sealing resin when electronic parts are resin-sealed by compression molding by using a powdery or granular material for resin sealing.SOLUTION: A resin sealing device 1A includes a molding die with a cavity 4, and resin-seals a chip by molding a sealing resin with a first standard with a thickness target value of t(mm) by using a powdery or granular material 5 for resin sealing supplied in the cavity 4. The resin sealing device 1A includes a resin material receiving means 36 receiving the material 5 for resin sealing, a main conveying means 38 conveying the material 5 for resin sealing to the molding die, a selecting means 46 selecting the material 5 for resin sealing based on a second standard of D≤3.0×t(mm) regarding a grain diameter D of the material 5 for resin sealing, and a first resin conveying part 44 conveying the material within the first standard, which is determined to satisfy the second standard, to the main conveying means 38. The first standard is 0.03(mm)≤t≤1.2(mm).