SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which secures heat radiation characteristics and transmission path characteristics for high speed communication to the exterior of a lamination package in the lamination of a calculation LSI and a memory LSI.SOLUTION: In a semiconductor package, an external communication LSI that communicates with a component located outside a lamination LSI, a memory LSI, and a calculation LSI are laminated in this order and the LSIs are connected by a through electrode. Further, output terminals of the multiple laminated LSI are connected with through electrode input terminals of the laminated memory LSI, and input terminals of the multiple laminated LSI are connected with through electrode output terminals of the laminated memory LSI, and therefore the external communication LSI and the calculation LSI are directly connected with the wiring of the memory LSI.