NITRIDE SINGLE CRYSTAL WITH THROUGH HOLE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride single crystal with a through hole which allows the through hole having a specific size to be precisely formed in the nitride single crystal having a large thickness.SOLUTION: A method of manufacturing a nitride single crystal with...

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Bibliographische Detailangaben
Hauptverfasser:	DOI NARIHIRO, KAJIMOTO TETSUJI, UCHIDA HIROBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CRYSTAL GROWTH DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY PERFORMING OPERATIONS POLISHING PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride single crystal with a through hole which allows the through hole having a specific size to be precisely formed in the nitride single crystal having a large thickness.SOLUTION: A method of manufacturing a nitride single crystal with a through hole 102 forms the through hole 102 whose 70% or more in a thickness direction thereof has a diameter in the range of 200-600 μm. The method includes: interposing loose abrasive between a major surface 103 of a nitride single crystal 101 having a thickness of 100-1000 μm and a tool; and punching the nitride single crystal 101 in a thickness direction thereof by pressing at least one of the nitride single crystal 101 and the tool while subjecting the tool to supersonic vibration.