THERMOELECTRIC CONVERSION DEVICE

PROBLEM TO BE SOLVED: To prevent breakage due to thermal stress of a bonding surface between a thermoelectric conversion element and an electrode in a thermoelectric conversion device.SOLUTION: The thermoelectric conversion device includes a first thermoelectric conversion element, a second thermoel...

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Bibliographische Detailangaben
Hauptverfasser: YAMAMOTO HIDENARI, KITA TAKUSHI, KINOSHITA YOHEI, KATAOKA TOMOJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent breakage due to thermal stress of a bonding surface between a thermoelectric conversion element and an electrode in a thermoelectric conversion device.SOLUTION: The thermoelectric conversion device includes a first thermoelectric conversion element, a second thermoelectric conversion element, and an electrode to which the first thermoelectric conversion element and the second thermoelectric conversion element are bonded by a bonding material. A recess is provided on an electrode surface between a portion where the first thermoelectric conversion element is bonded to the electrode and a portion where the second thermoelectric conversion element is bonded to the electrode. The recess is filled with a porous material.