DICING-DIE BONDING TAPE AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP WITH ADHESIVE LAYER

PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which allows an adhesive layer to be accurately cut off so that pickup properties of a semiconductor chip with the adhesive layer can be improved.SOLUTION: A dicing-die bonding tape 1 comprises: an adhesive layer 3; a base material layer 4 l...

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Bibliographische Detailangaben
1. Verfasser:	TAKEBE YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which allows an adhesive layer to be accurately cut off so that pickup properties of a semiconductor chip with the adhesive layer can be improved.SOLUTION: A dicing-die bonding tape 1 comprises: an adhesive layer 3; a base material layer 4 laminated on one surface 3a of the adhesive layer 3; and a dicing layer 5 laminated on a surface 4b of the base material layer 4 on a side opposite to the adhesive layer 3 side. The breaking elongation of the base material layer 4 at 23°C exceeds 50%. The tensile load of the base material layer 4 at 23°C and at an elongation of 10% is 4 N or lower. The tensile load of a laminate of the base material layer 4 and the dicing layer 5 at 23°C and at an elongation of 10% is equal to or lower than 1.5 times the tensile load of the dicing layer 5 at 23°C and at an elongation of 10%.