MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a semiconductor chip 8 mounted on a major surface of a package substrate 2 is sealed by a sealing member 11. On the major surface and a rear surface of the package substrate 2, wiring conductor patterns 4 are disposed and dummy conductor patterns 4 are also disposed in regions where the wiring conductor patterns 4 are not formed. Increasing the density of the conductor patterns 4 in the package substrate 2 in the above described manner reduces warpage and swell of the package substrate 2 which are caused by thermal treatment in the manufacturing processes of the semiconductor device 1.