WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE
PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TASHIRO KEI OGASAWARA YUKIO INAMASU HISASHI |
| description | PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of the discharge port, and a guide-out path 49a for discharging processing liquid scraped with the scraping side in front of the scraping side in a movement direction along the nozzle length direction, and the guide-out path is a V-shaped groove formed on a pad upper surface side along the movement direction, the V-shaped groove having the scraping side formed at its rear end edge part and gradually increasing in groove width and depth. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013165137A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013165137A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013165137A3</originalsourceid><addsrcrecordid>eNrjZAgK9wzw9HNXCHB00VHw84-K8nFV8HX09Atx9XP0c3ZVcHEN8wRSocEgRSEerhCFjn4uCs7-jiFgnUH-zq7BYHmIYh4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGxoZmpobO5oTJQiAOjWL3g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE</title><source>esp@cenet</source><creator>TASHIRO KEI ; OGASAWARA YUKIO ; INAMASU HISASHI</creator><creatorcontrib>TASHIRO KEI ; OGASAWARA YUKIO ; INAMASU HISASHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of the discharge port, and a guide-out path 49a for discharging processing liquid scraped with the scraping side in front of the scraping side in a movement direction along the nozzle length direction, and the guide-out path is a V-shaped groove formed on a pad upper surface side along the movement direction, the V-shaped groove having the scraping side formed at its rear end edge part and gradually increasing in groove width and depth.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130822&DB=EPODOC&CC=JP&NR=2013165137A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130822&DB=EPODOC&CC=JP&NR=2013165137A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TASHIRO KEI</creatorcontrib><creatorcontrib>OGASAWARA YUKIO</creatorcontrib><creatorcontrib>INAMASU HISASHI</creatorcontrib><title>WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of the discharge port, and a guide-out path 49a for discharging processing liquid scraped with the scraping side in front of the scraping side in a movement direction along the nozzle length direction, and the guide-out path is a V-shaped groove formed on a pad upper surface side along the movement direction, the V-shaped groove having the scraping side formed at its rear end edge part and gradually increasing in groove width and depth.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgK9wzw9HNXCHB00VHw84-K8nFV8HX09Atx9XP0c3ZVcHEN8wRSocEgRSEerhCFjn4uCs7-jiFgnUH-zq7BYHmIYh4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGxoZmpobO5oTJQiAOjWL3g</recordid><startdate>20130822</startdate><enddate>20130822</enddate><creator>TASHIRO KEI</creator><creator>OGASAWARA YUKIO</creator><creator>INAMASU HISASHI</creator><scope>EVB</scope></search><sort><creationdate>20130822</creationdate><title>WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE</title><author>TASHIRO KEI ; OGASAWARA YUKIO ; INAMASU HISASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013165137A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TASHIRO KEI</creatorcontrib><creatorcontrib>OGASAWARA YUKIO</creatorcontrib><creatorcontrib>INAMASU HISASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TASHIRO KEI</au><au>OGASAWARA YUKIO</au><au>INAMASU HISASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE</title><date>2013-08-22</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of the discharge port, and a guide-out path 49a for discharging processing liquid scraped with the scraping side in front of the scraping side in a movement direction along the nozzle length direction, and the guide-out path is a V-shaped groove formed on a pad upper surface side along the movement direction, the V-shaped groove having the scraping side formed at its rear end edge part and gradually increasing in groove width and depth.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2013165137A |
| source | esp@cenet |
| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T23%3A49%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TASHIRO%20KEI&rft.date=2013-08-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013165137A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |