WIPING PAD, NOZZLE MAINTENANCE DEVICE USING THE PAD, AND COATING PROCESSING DEVICE

PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of...

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Bibliographische Detailangaben
Hauptverfasser:	TASHIRO KEI, OGASAWARA YUKIO, INAMASU HISASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve productivity by eliminating wasting of chemicals such as processing liquid and shortening a tact time.SOLUTION: A wiping pad 49 includes a scraping side 49d1 provided to abut against a nozzle discharge port and nozzle side faces 32f, 32r across a length direction of the discharge port, and a guide-out path 49a for discharging processing liquid scraped with the scraping side in front of the scraping side in a movement direction along the nozzle length direction, and the guide-out path is a V-shaped groove formed on a pad upper surface side along the movement direction, the V-shaped groove having the scraping side formed at its rear end edge part and gradually increasing in groove width and depth.