METHOD OF MANUFACTURING VAPOR DEPOSITION MASK, AND METHOD OF MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a vapor deposition mask capable of providing both high precision and light weight even if its size is increased, and to provide a method of manufacturing an organic semiconductor element capable of manufacturing a precision organic semicondu...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA SUKEYUKI, OBATA KATSUYA, TAKEDA TOSHIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a vapor deposition mask capable of providing both high precision and light weight even if its size is increased, and to provide a method of manufacturing an organic semiconductor element capable of manufacturing a precision organic semiconductor element.SOLUTION: A method of manufacturing a vapor deposition mask includes the steps of: preparing a metal plate with a resin layer in which a resin layer is provided on one surface of the metal plate; forming a metal mask with a resin layer by forming, on the metal plate of the metal plate with the resin layer, a slit that penetrates only the metal plate; and then forming a resin mask by forming a plurality of lines of openings in all directions which correspond to a pattern vapor-deposited on the resin layer, through radiation of laser from the metal mask side.