SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To downsize a device and improve throughput, and be able to respond to the arrangement of a substrate delivery unit in different exposure equipment.SOLUTION: A substrate processing apparatus includes: a processing block including an applying processing unit and a developing pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIYATA AKIRA, NAKAJIMA SEIJI, ENOKIDA SUGURU, NAKAHARADA MASAHIRO, NAKAJO MASATO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To downsize a device and improve throughput, and be able to respond to the arrangement of a substrate delivery unit in different exposure equipment.SOLUTION: A substrate processing apparatus includes: a processing block including an applying processing unit and a developing processing unit for a plurality of stacked substrates; an exposure block S4 including an exposure processing unit for the substrates; and an interface block S3 linked to the processing block, for connecting between the processing block and the exposure block. The interface block includes: a shelf unit U6 in which a first mounting part TRS-COT for mounting the applied substrates, a second mounting part TRS-DEV for mounting the substrates before development, a buffer part BF, a cooling part ICPL and a substrate delivery part TRS are stacked; and first and second substrate transfer mechanisms 60A and 60B arranged on both sides of the shelf unit, each capable of delivering the substrates between itself and the shelf unit, and one of the mechanisms capable of delivering the substrates between itself and the exposure block.