METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can improve the quality of the semiconductor device after a semiconductor wafer having a thick part and a thin part is diced.SOLUTION: A method of manufacturing a semiconductor device includes a step 101 of prepar...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can improve the quality of the semiconductor device after a semiconductor wafer having a thick part and a thin part is diced.SOLUTION: A method of manufacturing a semiconductor device includes a step 101 of preparing a semiconductor wafer which has a thick part at a peripheral end and a thin part at a center part, a step 102 of mounting a support member on one surface of the semiconductor wafer, a step 103 of dividing the semiconductor wafer into the thick part and thin part, and a step 104 of cutting the thin part while supporting the thin part by the support member. |
---|