METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can improve the quality of the semiconductor device after a semiconductor wafer having a thick part and a thin part is diced.SOLUTION: A method of manufacturing a semiconductor device includes a step 101 of prepar...

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Hauptverfasser: NAKADA KAZUNARI, TERASAKI YOSHIAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can improve the quality of the semiconductor device after a semiconductor wafer having a thick part and a thin part is diced.SOLUTION: A method of manufacturing a semiconductor device includes a step 101 of preparing a semiconductor wafer which has a thick part at a peripheral end and a thin part at a center part, a step 102 of mounting a support member on one surface of the semiconductor wafer, a step 103 of dividing the semiconductor wafer into the thick part and thin part, and a step 104 of cutting the thin part while supporting the thin part by the support member.