THIN SLICE PRODUCING DEVICE AND METHOD FOR REMOVING SWARF

PROBLEM TO BE SOLVED: To provide a thin slice producing device capable of reliably removing swarf adhered to the tip part of a cutting blade without significantly changing environment in the surroundings of an embedding block.SOLUTION: An embedding block B is cut by relatively moving a specimen supp...

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Bibliographische Detailangaben
1. Verfasser:	ITO TETSUMASA
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thin slice producing device capable of reliably removing swarf adhered to the tip part of a cutting blade without significantly changing environment in the surroundings of an embedding block.SOLUTION: An embedding block B is cut by relatively moving a specimen support 11 which supports the embedding block B to a cutting blade 12. A suction nozzle 19 which sucks swarf 18 adhered to the tip part 12a of the cutting blade 12 to be removed is provided. A suction port 19a of the suction nozzle 19 is arranged on the side of the specimen support 11 from the tip part 12a of the cutting blade 12 in the thickness direction of a thin slice in the embedding block B.