MULTI-LAYER PAPER SUBSTRATE FOR HOUSING BOARD OF CHIP-TYPE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a multi-layer paper substrate for a housing board of a chip-type electronic component, which is used for forming a housing board that has cavities having short pitches therebetween, and can form the cavities with excellent precision therein.SOLUTION: The multi-layer...

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Hauptverfasser:	FURUKAWA HIROYUKI, WATANABE YASUHIRO, KAKIMI SHUNSUKE, MOTOSUGI NAOYA, MANDO RITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL IMPREGNATING OR COATING OF PAPER MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKAGES PACKAGING ELEMENTS PACKING PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PERFORMING OPERATIONS PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRODUCTION OF CELLULOSE PULP COMPOSITIONS STORING TEXTILES TRANSPORTING TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G UNPACKING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multi-layer paper substrate for a housing board of a chip-type electronic component, which is used for forming a housing board that has cavities having short pitches therebetween, and can form the cavities with excellent precision therein.SOLUTION: The multi-layer paper substrate for the housing board of the chip-type electronic component contains 100 mmor less of an adhesive foreign matter per 100 g of a dried solid content, an inorganic filler, and 0.1-10 mass% of ash with respect to the dried solid content.