METHOD FOR PRODUCING PLATED MATERIAL, AND PLATED MATERIAL

PROBLEM TO BE SOLVED: To provide a method for producing a plated material, capable of securing, when a plated material having a nickel plating film formed by electroless plating and a copper plating film covering a surface of the nickel plating film is heated, the adhesion strength of the electrolyt...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATSUJI ERIKA, SAWAZAKI KOICHI, YANAGIMOTO HIROSHI, TANIBUCHI SHUHEI, OMURO WATARU, YOSHIDA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for producing a plated material, capable of securing, when a plated material having a nickel plating film formed by electroless plating and a copper plating film covering a surface of the nickel plating film is heated, the adhesion strength of the electrolytic nickel plating film to a treated surface of a resin substrate.SOLUTION: A method for producing the plated material 1 includes the steps of: adsorbing a metal catalyst to the treated surface 11 of the resin substrate 10; covering the treated surface 11 with the metal catalyst adsorbed thereto with the electroless nickel plating film 20; and covering the surface of the electroless nickel plating film 20 with the copper plating film 30. In the step of covering with the electroless nickel plating film 20, the electroless nickel plating film is formed until it has a film thickness capable of preventing, when the plated material 20 being produced is heated, ionized copper ions of the copper plating film 30 from dispersing to the resin substrate 10 through the electroless nickel plating film 20.