FILM FORMING APPARATUS AND FILM FORMING METHOD

PROBLEM TO BE SOLVED: To provide a film forming apparatus and a film forming method, capable of rapidly forming a hard film on a surface of a metal substrate while suppressing a reduction in hardness of the metal substrate.SOLUTION: In the method for forming a film on a surface of the metal substrat...

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Hauptverfasser: KANEDA HIDEKI, TAKAOKA YASUYUKI, UMEHARA TOKUJI, TAKI KAZUYA, SHINODA KENTARO, KAMISAKA HIROYUKI
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creator KANEDA HIDEKI
TAKAOKA YASUYUKI
UMEHARA TOKUJI
TAKI KAZUYA
SHINODA KENTARO
KAMISAKA HIROYUKI
description PROBLEM TO BE SOLVED: To provide a film forming apparatus and a film forming method, capable of rapidly forming a hard film on a surface of a metal substrate while suppressing a reduction in hardness of the metal substrate.SOLUTION: In the method for forming a film on a surface of the metal substrate M within a treatment container 1 provided with a gas supply unit 4 capable of supplying a raw material gas and an inert gas and a plasma generation unit 5, the temperature of the metal substrate M is measured, a remaining time before the end of film forming and a temperature process to the end of film forming are calculated from the measured temperature, and a tempering parameter at the end of film forming is calculated based on them. The calculated parameter is compared with a set tempering parameter which is set so as not to cause hardness reduction of the metal substrate, and when the tempering parameter at the end of film forming is larger than the set tempering parameter, the film forming is performed while setting a film forming condition such that the tempering parameter at the end of film forming becomes smaller.
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The calculated parameter is compared with a set tempering parameter which is set so as not to cause hardness reduction of the metal substrate, and when the tempering parameter at the end of film forming is larger than the set tempering parameter, the film forming is performed while setting a film forming condition such that the tempering parameter at the end of film forming becomes smaller.</description><language>eng</language><subject>BEARINGS ; BLASTING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELEMENTS OR CRANKSHAFT MECHANISMS ; ENGINEERING ELEMENTS AND UNITS ; FLEXIBLE SHAFTS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LIGHTING ; MECHANICAL ENGINEERING ; METALLURGY ; ROTARY BODIES OTHER THAN GEARING ELEMENTS ; SHAFTS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THERMAL INSULATION IN GENERAL ; WEAPONS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130815&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013155409A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130815&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013155409A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANEDA HIDEKI</creatorcontrib><creatorcontrib>TAKAOKA YASUYUKI</creatorcontrib><creatorcontrib>UMEHARA TOKUJI</creatorcontrib><creatorcontrib>TAKI KAZUYA</creatorcontrib><creatorcontrib>SHINODA KENTARO</creatorcontrib><creatorcontrib>KAMISAKA HIROYUKI</creatorcontrib><title>FILM FORMING APPARATUS AND FILM FORMING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a film forming apparatus and a film forming method, capable of rapidly forming a hard film on a surface of a metal substrate while suppressing a reduction in hardness of the metal substrate.SOLUTION: In the method for forming a film on a surface of the metal substrate M within a treatment container 1 provided with a gas supply unit 4 capable of supplying a raw material gas and an inert gas and a plasma generation unit 5, the temperature of the metal substrate M is measured, a remaining time before the end of film forming and a temperature process to the end of film forming are calculated from the measured temperature, and a tempering parameter at the end of film forming is calculated based on them. 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subjects BEARINGS
BLASTING
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELEMENTS OR CRANKSHAFT MECHANISMS
ENGINEERING ELEMENTS AND UNITS
FLEXIBLE SHAFTS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LIGHTING
MECHANICAL ENGINEERING
METALLURGY
ROTARY BODIES OTHER THAN GEARING ELEMENTS
SHAFTS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
THERMAL INSULATION IN GENERAL
WEAPONS
title FILM FORMING APPARATUS AND FILM FORMING METHOD
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