FILM FORMING APPARATUS AND FILM FORMING METHOD

PROBLEM TO BE SOLVED: To provide a film forming apparatus and a film forming method, capable of rapidly forming a hard film on a surface of a metal substrate while suppressing a reduction in hardness of the metal substrate.SOLUTION: In the method for forming a film on a surface of the metal substrate M within a treatment container 1 provided with a gas supply unit 4 capable of supplying a raw material gas and an inert gas and a plasma generation unit 5, the temperature of the metal substrate M is measured, a remaining time before the end of film forming and a temperature process to the end of film forming are calculated from the measured temperature, and a tempering parameter at the end of film forming is calculated based on them. The calculated parameter is compared with a set tempering parameter which is set so as not to cause hardness reduction of the metal substrate, and when the tempering parameter at the end of film forming is larger than the set tempering parameter, the film forming is performed while setting a film forming condition such that the tempering parameter at the end of film forming becomes smaller.