SUBSTRATE HOLDER AND PLATING APPARATUS

PROBLEM TO BE SOLVED: To absorb a change in thickness of a substrate while preventing deflection of the substrate even if the thickness of the substrate varies, and to hold the substrate while keeping a compression dimension of a substrate sealing member within a certain range more stably.SOLUTION:...

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1. Verfasser: FUJIKATA JUNPEI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To absorb a change in thickness of a substrate while preventing deflection of the substrate even if the thickness of the substrate varies, and to hold the substrate while keeping a compression dimension of a substrate sealing member within a certain range more stably.SOLUTION: A substrate holder includes: a first holding member 54 and a second holding member 58, both for detachably holding a substrate W by clamping a peripheral portion of the substrate W therebetween; and a substrate sealing member 66 mounted to the second holding member 58 and sealing an interval between the second holding member 54 and the peripheral portion of the substrate W along a substrate sealing line 64 when the substrate W is held by the second holding member 58 and the first holding member 54. The first holding member 54 includes a thickness absorbing mechanism 88 including a movable base 82 and a compression spring 86, for example, which bias the substrate W toward the second holding member 58 at positions along the substrate sealing line 64 to absorb a change in thickness of the substrate W when the first holding member and the second holding member 58 hold the substrate by clamping the peripheral portion of the substrate W therebetween.